Using our unique Computational Imaging Technique, we developed an innovative 3D inspection technology

Innovative 3D Inspection 

We succeeded in developing an innovative 3D inspection solution through our unique Computational Imaging Technique. Our 3D inspection solution can detect defects and measure elevations or deformations in nanometer accuracy. This technology is expected to replace existing 2D inspection solutions, providing a major upgrade to their limited inspection areas and slow analysis times.
 
Our 3D inspection solution generates 3D information by analyzing the measuring phase, wavelength, and reflectance data in our Computational Imaging Technique.

Our Inspection Technology...

  1. 1Provides nanometer precision.
  2. 2Encompasses a broad surface area – upwards of several hundred millimeters – with just 1 inspection.
  3. 3Provides 3D surface information and calculations within a few seconds.
  4. 4Identifies minuscule defects, deformations, and contaminants that cannot be easily detected with 2D inspection.

Micro-cracks (Micro-fracturing) in Semiconductor Substrate

  • Image From Existing 2D Inspection Solution

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    Image From Our 3D Inspection Solution

Electronic Component Defect Inspection Images (Puncture, Scratch)

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    Image From Our 3D Inspection Solution

  • Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat.

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    Image From Our 3D Inspection Solution

Our 3D Inspection Solution 

PRODUCTS

  • 3D Defect Inspection System (DS 100)
  • 3D Contaminant Inspection System (PS 100)
  • 3D Shape Inspection System (PM 100)